saman_baya

Kayayyaki

Babban sake amfani da na'urar busar da iska mai ƙarfi, duk girma dabam-dabam, koren silicon carbide, foda mai kyau gsic don gogewa da niƙawa


  • Launi:Kore
  • Abubuwan da ke ciki:>98%
  • Ma'adinai na asali:α-SiC
  • Siffar lu'ulu'u:Lu'ulu'u mai siffar murabba'i
  • Taurin Mohs:3300kg/mm3
  • Yawan gaske:3.2g/mm
  • Yawan yawa:1.2-1.6g/mm3
  • Takamaiman nauyi:3.20-3.25
  • Cikakken Bayani game da Samfurin

    AIKACE-AIKACE

    Gabatarwa ta Green Silicon Carbide

    Foda mai launin kore na silicon carbide abu ne mai inganci wanda ake amfani da shi don aikace-aikace daban-daban kamar gogewa da goge yashi. An san shi da tauri mai kyau, iya yankewa mai ban sha'awa, da kuma ƙarfi mai kyau. Ana samar da jan ƙarfe na silicon carbide ta hanyar dumama cakuda yashi na silica da carbon zuwa yanayin zafi mai yawa a cikin tanda mai amfani da wutar lantarki. Sakamakon haka shine kayan lu'ulu'u mai launin kore mai kyau.

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    gsic (52)
    gsic (6)

    Kayan Zane na Green Silicon Carbide

     

    Kayayyakin zahiri
    Siffar lu'ulu'u Mai siffar murabba'i mai siffar murabba'i
    Yawan yawa 1.55-1.20g/cm3
    Yawan hatsi 3.90g/cm3
    Taurin Mohs 9.5
    Taurin Ƙulli 3100-3400 Kg/mm2
    Ƙarfin lalatawa 5800 kPa·cm-2
    Launi Kore
    Wurin narkewa 2730ºC
    Maida wutar lantarki ta thermal (6.28-9.63)W·m-1·K-1
    Ma'aunin faɗaɗawa na layi (4 - 4.5)*10-6K-1(0 - 1600 C)
    Girman Rarraba hatsi Sinadarin Sinadarai (%)
      D0 ≤ D3 ≤ D50 D94 ≥ SiC ≥ FC ≤ Fe2O3≤
    #700 38 30 17±0.5 12.5 99.00 0.15 0.15
    #800 33 25 14±0.4 9.8 99.00 0.15 0.15
    #1000 28 20 11.5±0.3 8.0 98.50 0.25 0.20
    #1200 24 17 9.5±0.3 6.0 98.50 0.25 0.20
    #1500 21 14 8.0±0.3 5.0 98.00 0.35 0.30
    #2000 17 12 6.7±0.3 4.5 98.00 0.35 0.30
    #2500 14 10 5.5±0.3 3.5 97.70 0.35 0.33
    #3000 11 8 4.0±0.3 2.5 97.70 0.35 0.33

     


  • Na baya:
  • Na gaba:

    1. Nika da Yankewa: niƙa daidai gwargwado na ƙarfe masu tauri, kayan yumbu, da gilashi
    2. Kafawa da Tsaftacewa: kafawa da gyaran kayan aikin yankewa kamar wuƙaƙe, ƙwanƙwasa, da ruwan wukake.
    3. Abrasive Blasting: shirye-shiryen saman, tsaftacewa, da aikace-aikacen etching
    4. Gogewa da Lapping: gyaran ruwan tabarau, madubai, da kuma gyaran wafer na semiconductor
    5. Saƙa Waya: wafers na silicon, duwatsu masu daraja, da tukwane
    6. Masana'antar Refractory da Ceramic: kera bututun ƙarfe, kayan daki na murhu, da sauran abubuwan da ke da zafi mai yawa
    7. Masana'antar Semiconductor:
    8. Aikace-aikacen ƙarfe

     

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